SAMSUNG TECHWIN

Mechanical Engineering Department, R&D Center, Samsung Techwin 

Research Engineer (Jan 2007 – Jan 2011)

  • Designed semiconductor machinery by using 3dimension tool(Pro/Engineer)
  • Tested assembly line processes through virtual modeling and document

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s

%d bloggers like this: